股票代码：688216
圆片厚度规则
Wafer Thickness Rule
圆片厚度如不在太阳成集团tyc151cc规格内必须将圆片减薄
Back grinding is required if the thickness exceeds CPC spec.
圆片厚度规则
Wafer Thickness Rule
圆片厚度如不在太阳成集团tyc151cc规格内必须将圆片减薄
Back grinding is required if the thickness exceeds CPC spec.
